The X9 Spider also connects directly to next-gen sensors without intermediate electronics – simplifying their connection to the electronic system – making the sensors themselves equally scalable and modular. An X9 module literally fits in the palm of your hand like a cell phone.īuilt for limitless expandability, the X9 Spider family is based on new, patent-pending mechanical features that allow devices to stack and connect together electrically, physically and thermally but at light speed (literally) with minimal signal bottlenecks. “By breaking the outdated and needlessly expensive, centralised ATR-style board-and-chassis paradigm into Thunderbolt technology-connected distributed compute modules, the X9 Spider family gives designers ruggedised, as-needed capabilities to solve any compute problem in any environment – from the smallest enclosure to the largest C5ISR system.” Rugged X9 Spider modules are small and modular, plug-and-play, and emphasise flexibility over ATR chassis’ physical and electrical constraints.
“Next-generation platforms like aircraft, vehicles, UAS and sensor systems require next-generation capabilities to maximise computing resources in lean, flexible and cost-effective ways,” said Ben Sharfi, Chief Architect and CEO, GMS.
